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| CYStech Electronics Corp. 1.0Amp. Surface Mount Fast Recovery Diodes Spec. No. : C340SF Issued Date : 2003.06.24 Revised Date : Page No. : 1/3 CFR10XSF Series Features * For surface mounted applications. * Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 * Low leakage current * High surge capability * High temperature soldering: 250C/10 seconds at terminals * Exceeds environmental standards of MIL-S-19500/228 Mechanical Data * Case: Molded plastic, JEDEC SOD-123/Mini SMA. * Terminals: Solder plated, solderable per MIL-STD-750 method 2026 * Polarity: Indicated by cathode band. * Packaging: 12mm tape per EIA STD RS-481. * Weight: 0.04 gram Maximum Ratings and Electrical Characteristics (Rating at 25C ambient temperature unless otherwise specified. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=1A (Note 1) Reverse Recovery Time Average forward rectified current @TA=55 Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25(Note 1) VR=VRRM,TA=100(Note 1) Maximum thermal resistance, Junction to ambient Diode junction capacitance (Note 2) Storage temperature Operating temperature Symbol VRRM VRMS VR VF trr IO IFSM CFR 101 50 35 50 1.3 150 CFR 102 100 70 100 1.3 150 CFR 103 200 140 200 1.3 150 Type CFR 104 400 280 400 1.3 150 1 30 CFR 105 600 420 600 1.3 250 CFR 106 800 560 800 1.3 500 CFR 107 1000 700 1000 1.3 500 Units V V V V ns A A IR Rth,JA CJ Tstg TJ 5 100 42 (typ) 15 (typ) -55 ~ +150 -55 ~ +150 A A /W pF Notes : 1. Pulse test, pulse width=300sec, 2% duty cycle 2 . f=1MHz and applied 4.0VDC reverse voltage. CFR10XSF CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Current Derating Curve 1.2 Average Forward Current---I O(A) Forward Current---I F(A) 1 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 140 160 Ambient Temperature---TA() Single Phase, Half Wave 60Hz, Resistive or Inductive Load Spec. No. : C340SF Issued Date : 2003.06.24 Revised Date : Page No. : 2/3 Forward Current vs Forward Voltage 100 10 1 Tj=25 Pulse Width=300s Duty Cycle=1% 0.1 0.01 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Forward Voltage---VF(V) Maximum Non-Repetitive Forward Surge Current 40 Peak Forward Surge Current--IFSM(A) Junction Capacitance---C J(pF) 40 35 30 25 20 15 10 5 0 1 10 Numbers of Cycles at 60Hz 100 0.01 Junction Capacitance vs Reverse Voltage 30 Tj=25, 8.3ms Single Half Sine Wave, JEDEC method 20 10 0 0.1 1 10 100 Reverse Voltage---VR(V) CFR10XSF CYStek Product Specification CYStech Electronics Corp. SOD-123 Dimension Spec. No. : C340SF Issued Date : 2003.06.24 Revised Date : Page No. : 3/3 Marking Code: Device CFR 101 Code F11 Device CFR 105 Code F15 CFR 102 F12 CSFR 106 F16 CFR 103 F13 CSFR 107 F17 CFR 104 F14 SOD-123 Plastic Surface Mounted Package CYStek Package Code: SF *:Typical DIM A B C D Inches Min. Max. 0.146 0.161 0.055 0.071 0.012(typ) 0.094 0.110 Millimeters Min. Max. 3.7 4.1 1.4 1.8 0.3(typ) 2.4 2.8 DIM E F G - Inches Min. Max. 0.055 0.063 0.035(typ) 0.035(typ) - Millimeters Min. Max. 1.4 1.6 0.9(typ) 0.9(typ) - Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CFR10XSF CYStek Product Specification |
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